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Zalman CPU cooling system CNPS80G REV.3, LGA1700, 1200, 115X, AM5, AM4, AM3+, AM3, TDP 65W

SKU: CNPS80GREV.3
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Technical characteristics Zalman CPU cooling system CNPS80G REV.3, LGA1700, 1200, 115X, AM5, AM4, AM3+, AM3, TDP 65W:
Main features
Full list of features
Appointment for processor
A type Active cooler
The fans 1 pcs
Heatsink Material aluminum
Processor compatibility AM3+
AM3
AM4
LGA115X
LGA1200
LGA1700
AM5
Fan diameter mm 85
Bearing Type Long Life Bearing
Maximum speed, rev / min 2000
Max. air flow 27.18 CFM
The maximum TDP 65 W
Noise level 28 dB
Socket 4-pin
Main
Appointment for processor
A type Active cooler
Design
The fans 1 pcs
Heatsink Material aluminum
Processor compatibility AM3+
AM3
AM4
LGA115X
LGA1200
LGA1700
AM5
Fan
Fan diameter mm 85
Bearing Type Long Life Bearing
Maximum speed, rev / min 2000
Max. air flow 27.18 CFM
The maximum TDP 65 W
Static pressure 1.51 (мм H2O)
Physical
Noise level 28 dB
Socket 4-pin
Colour black
Warranty
Warranty 12 months
Package dimensions
Width 130 mm
Height 80 mm
Length 130 mm
Weight 0.27 kg
Volume 0.0014 m3
The CNPS80G REV.3 CPU cooling system is a highly compatible and efficient cooling solution for high-performance processors. It supports both Intel and AMD Ryzen processors, ensuring seamless power management and compatibility. With its unique Flower Heatsink (FHS) fin design, it offers optimized heat dissipation and even distribution throughout the heatsink, allowing for a compact size with a TDP of 65W.
96 GEL*
in stock
 
* Average price on market
Features:

Fully compatible with the latest high performance processors

It is fully compatible with the latest Intel's processors as well as AMD Ryzen. Power management technology for each processor is seamless, so you don't have to worry about compatibility issues.

Flower Heatsink (FHS) fin design for optimized performance

ZALMAN is the first in the world to introduce FHS (Flower Heatsink) technology by producing a three-dimensional radial shape fins throught the compression process of an aluminum plate. It features a wide heat dissipation structure compared to other compression type heatsink, and the heat generated from the CPU is evenly distributed throughout the heatsink which made it possible to achieve 65W TDP in a compact size.

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